HEXMC IC2000M77RA

HEXMC IC2000M77RA is a high performance carbon molding compound specifically designed for compression molding applications in advanced materials. The epoxy matrix and high 57% carbon fiber volume content of HEXMC IC2000M77RA enables complex shaped components to be rapidly molded for a wide range of uses. HEXMC IC2000M77RA provides a competitive alternative to lightweight metal alloys with benefits like complex shape molding capability, no material waste and rapid 3 minute 150°C cure cycles well suited for advanced materials product development. HEXMC IC2000M77RA resin exhibits mechanical properties like 300MPa tensile strength, 290MPa compression strength and 38GPa modulus ideal for structural applications in emerging advanced materials industries.