BYKETOL-AQ

BYKETOL-AQ is a silicone-free surface additive that prevents bubbles and boiling marks in aqueous baking applications. BYKETOL-AQ does not contain any alkylphenol ethoxylates and is HAPS and APEO-free. It has a density of 0.78 g/ml and non-volatile matter content of 4%. BYKETOL-AQ functions as a leveling and defoaming additive. It helps eliminate surface defects like cratering and pinholes by preventing the formation of bubbles during the baking process. Recommended addition levels of BYKETOL-AQ range from 0.3-3% based on the total formulation. Optimal amounts are determined through laboratory testing. BYKETOL-AQ can be incorporated into the millbase or added post-addition with sufficient shear. The product supports smooth, defect-free surface finishes after thermal curing.